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Introduction to microsystem packaging technology

Jin, Yufeng

Introduction to microsystem packaging technology - New York, CRC Press, 2011. - xiii,218p.

ISBN: 9781138374256

Subjects--Topical Terms:
MICROELECTRONIC PACKAGING
MEMS
INTERCONNECTION TECHNOLOGY
OPTOELECTRONICS

Dewey Class. No.: 621.381046 JIN/I

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