Thermo-Mechanical Behaviour of Structural Lightweight Alloys (Record no. 27452)
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| 000 -LEADER | |
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| fixed length control field | 01141nam a2200121Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 220620s9999||||xx |||||||||||||| ||und|| |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Requena, Guillermo |
| 245 #0 - TITLE STATEMENT | |
| Title | Thermo-Mechanical Behaviour of Structural Lightweight Alloys |
| 546 ## - LANGUAGE NOTE | |
| Language note | English[eng] |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | n/a||microstructure||strength||X-ray diffraction||7003 alloy||in situ synchrotron radiation diffraction||3D microstructure||materials modelling||zinc addition||tensile test||connectivity||DSC||in-situ tensile deformation||wire fabrication||magnesium alloys||welding||alloying||AlMgSi alloy||LPSO-phase||mechanical properties||Mg-Nd-Zn alloys||thermomechanical treatment||Cast Al-Si alloys||EN AW-6082||3D characterization||damage||dislocations||dynamic recrystallization||powder metallurgy||aluminum welding||recovery||corrosion resistance||recrystallisation||numerical simulation||second phases||digital image correlation||ECAP||aluminum nanocomposites||deformation behaviour||thermo-mechanical analysis||neodymium||aluminium alloy||TIG fillers||electrical conductivity||TEM||synchrotron tomography |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://mdpi.com/books/pdfview/book/1564">https://mdpi.com/books/pdfview/book/1564</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Koha item type | E-Books |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Date acquired | Total Checkouts | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|
| Kerala University of Digital Sciences, Innovation and Technology Knowledge Centre | Kerala University of Digital Sciences, Innovation and Technology Knowledge Centre | 20/06/2022 | 20/06/2022 | 20/06/2022 | E-Books |