3D stacked chips: From Emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis

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Material type: Text

TextPublication details: Switzerland, Springer, 2016Description: xxiii, 339pISBN:

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Item type	Current library	Collection	Call number	Status	Date due	Barcode
Books	Kerala University of Digital Sciences, Innovation and Technology Knowledge Centre Applied Electronics	Non Fiction	621.3815 ELF/D (Browse shelf(Opens below))	Available		5702

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