TY  - BOOK
TI  - Nano- and Microcomposites for Electrical Engineering Applications
KW  - adhesion in multilayer composites||functionalized polymers||stability/reliability of devices and ageing phenomena||electrical characterization of composite materials||curing of composites||thermal conductivity||surface functionalization of micro- and nanoparticles||composite processing
UR  - http://www.mdpi.com/books/pdfview/book/238
ER  -