000			01377nam a2200133Ia 4500
008			220616s9999||||xx |||||||||||||| ||und||
020			_a9783040000000
245		0	_aComposite Materials in Design Processes
546			_aEnglish[eng]
650			_alaser etching||water jet||polycrystalline silicon||orthogonal test||physical conditions||electrodeposition||SiC whisker||texture||morphology||self-healing||epoxy resin||microcapsule||insulating composite||breakdown strength||physical damage||electrical tree||analytical model||fabrics||weave pattern||shear deformation||tension-shear coupling||RTM||composites||FEM simulation||permeability characterization||design optimization||solar vehicles||photovoltaic roof||lightweight structures||carbon fiber-reinforced plastic (CFRP)||natural frequencies||stiffness||heat exchange||Ansys ACP||constructal design||resin flow||porous media||numerical simulation||filling time||composite ship||composite structure||glass fiber content||void volume||burn-off test||calcination test||composite laminates||nanofibers||fracture||polyvinylidene fluoride||polysulfone||CFRP laminate||thin composite panel||viscoelastic material||vibration response||damping||experimental modal analysis||slamming||damage||viscoelastic layer||prepreg||OoA||n/a
700			_aMinak, Giangiacomo
856			_uhttps://mdpi.com/books/pdfview/book/3783
942			_cEB
999			_c20463 _d20463