000			01388nam a2200133Ia 4500
008			220620s9999||||xx |||||||||||||| ||und||
020			_a9783040000000
245		0	_aChallenges and New Trends in Power Electronic Devices Reliability
546			_aEnglish[eng]
650			_aphotovoltaic system||battery||DC-coupled configuration||AC-coupled configuration||mission profile||reliability||LED||thermal cycling test||accelerated test||solder joint||cracks||current harmonics||voltage harmonics||power electronic converters||cables||capacitors||PPS||high-power thyristors||reverse recovery currents||electromagnetic launching field||segmented LSTM||microgrid inverter||IGBT reliability||online evaluation||fusion algorithm||multi-chip IGBT module||bond wire||module transconductance||temperature calibration||failure monitoring||sensor lamp||low-light mode||high-light mode||AC motor drive||junction temperature||lifetime prediction||power MOSFET||loss modeling||SiC MOSFET||AlGaN/GaN HEMT||cascode structure||single event effects||technology computer-aided design simulation||heavy-ion irradiation experiment||photovoltaic systems||DC/AC converter||maintenance||power system faults||availability||condition monitoring||power device||power electronics||n/a
700			_aFalco, Pasquale De||Chiodo, Elio||Di Noia, Luigi Pio
856			_uhttps://mdpi.com/books/pdfview/book/3724
942			_cEB
999			_c30589 _d30589