| 000 | 00671nam a22002417a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20220107122900.0 | ||
| 008 | 201022b xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9781138374256 | ||
| 040 | _cIIITMK | ||
| 082 | _a621.381046 JIN/I | ||
| 100 |
_aJin, Yufeng _918439 |
||
| 245 | _aIntroduction to microsystem packaging technology | ||
| 260 |
_aNew York, _bCRC Press, _c2011. |
||
| 300 | _axiii,218p. | ||
| 650 |
_aMICROELECTRONIC PACKAGING _918440 |
||
| 650 |
_aMEMS _918441 |
||
| 650 |
_aINTERCONNECTION TECHNOLOGY _918442 |
||
| 650 |
_aOPTOELECTRONICS _918443 |
||
| 700 |
_aWang, Zhiping _918444 |
||
| 700 |
_aChen, Jing _918445 |
||
| 942 |
_2ddc _cBK |
||
| 999 |
_c6817 _d6817 |
||